ICMMME 2018, The 3rd International Conference on Manufacturing, Material and Metallurgical Engineering, will take place in Kuala Lumpur, Malaysia from March 17-19, 2018.
ICMMME 2018 is a not-to-be-missed opportunity that distills the most current knowledge on a rapidly advancing discipline in one conference. Join key researchers and established professionals in the field of Manufacturing, Material and Metallurgical Engineering as they assess the current state-of-the-art and roadmap crucial areas for future research.
We aim to building an idea-trading platform for the purpose of encouraging researcher participating in this event. The papers to be presented at ICMMME 2018 address many grand challenges in modern engineering. The full papers to be presented will be peer-reviewed by expert reviewers including the whole Organising Committees members of ICMMME 2018.
We will be thankful for the contributions to ICMMME 2018. We look forward to your participation and continued engagement at future ICMMME conferences.
Call for Paper download (click) | Conference Program Available Middle February (click)
The submitted full papers will be peer-reviewed, accepted and registered full papers will be published into IOP Conference Series: Materials Science and Engineering(ISSN: 1757-899X),which is indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
Send your full paper/abstract to Easy Chair Submission System (.pdf only). If you dont have an account, please register first. Or submit directly to email@example.com.
Submission Deadline November 5, 2017 Notification Date November 25, 2017 Registration December 15, 2017 Conference Date March 17-18, 2018 Social Event (Optional) March 19, 2018
- Welcome several excellent experts to join the technical committee. (check)
- ICMMME 2018 call for papers!! Submission is open now.
- ICMMME 2017 proceedings has been successfully indexed by EI & SCOPUS.
- ICMMME 2017 proceedings publised by IOP Conference Series: Materials Science and Engineering has been online.
- 2017 conference photo released, many thanks for the participants this year, congratulations goes to the winner of best oral presentations, we look forward to welcoming you in 2018.
|Washington University in St. Louis, USA|